JPH038432U - - Google Patents
Info
- Publication number
- JPH038432U JPH038432U JP6830589U JP6830589U JPH038432U JP H038432 U JPH038432 U JP H038432U JP 6830589 U JP6830589 U JP 6830589U JP 6830589 U JP6830589 U JP 6830589U JP H038432 U JPH038432 U JP H038432U
- Authority
- JP
- Japan
- Prior art keywords
- plate
- peeling
- spatula
- detecting
- crystal wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013078 crystal Substances 0.000 claims description 3
- 229910021642 ultra pure water Inorganic materials 0.000 claims description 3
- 239000012498 ultrapure water Substances 0.000 claims description 3
Landscapes
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6830589U JPH038432U (en]) | 1989-06-12 | 1989-06-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6830589U JPH038432U (en]) | 1989-06-12 | 1989-06-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH038432U true JPH038432U (en]) | 1991-01-28 |
Family
ID=31602626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6830589U Pending JPH038432U (en]) | 1989-06-12 | 1989-06-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH038432U (en]) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53117378A (en) * | 1977-03-23 | 1978-10-13 | Nec Corp | Assembling device of semiconductor device |
| JPS5874040A (ja) * | 1981-09-04 | 1983-05-04 | エムイーエムシー エレクトロニック マテリアルズ，インコーポレーテッド | ウエハ−研磨用温度制御方法およびその装置 |
| JPS61127142A (ja) * | 1984-11-26 | 1986-06-14 | Sankyo Seiki Mfg Co Ltd | ウエハ−の剥離装置 |
| JPS6388828A (ja) * | 1986-10-01 | 1988-04-19 | Hitachi Electronics Eng Co Ltd | 蒸気乾燥システム |
| JPS6392038A (ja) * | 1986-10-06 | 1988-04-22 | Matsushita Electric Ind Co Ltd | チツプ供給方法 |
| JPH0193126A (ja) * | 1987-10-03 | 1989-04-12 | Takahiro Oishi | プレートから半導体ウエハの剥がし方法 |
-
1989
- 1989-06-12 JP JP6830589U patent/JPH038432U/ja active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53117378A (en) * | 1977-03-23 | 1978-10-13 | Nec Corp | Assembling device of semiconductor device |
| JPS5874040A (ja) * | 1981-09-04 | 1983-05-04 | エムイーエムシー エレクトロニック マテリアルズ，インコーポレーテッド | ウエハ−研磨用温度制御方法およびその装置 |
| JPS61127142A (ja) * | 1984-11-26 | 1986-06-14 | Sankyo Seiki Mfg Co Ltd | ウエハ−の剥離装置 |
| JPS6388828A (ja) * | 1986-10-01 | 1988-04-19 | Hitachi Electronics Eng Co Ltd | 蒸気乾燥システム |
| JPS6392038A (ja) * | 1986-10-06 | 1988-04-22 | Matsushita Electric Ind Co Ltd | チツプ供給方法 |
| JPH0193126A (ja) * | 1987-10-03 | 1989-04-12 | Takahiro Oishi | プレートから半導体ウエハの剥がし方法 |